Abhigyan Goswami

Semiconductor metrology solution

Contactless temperature measurement of silicon wafer

A non-contact temperature measurement technology for silicon wafer under processing, with high accuracy, fast acquisition speed, and a large measurement range using a all-fiber cost-effective supercontinuum source.

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Technology at a glance

Specifications

• High measurement accuracy: ~1 °C.
• Large measurement range: 30-550 °C.
• Fast measurement speed: ~66 ms.
• Multi-point measurement.

Architecture

• All-fiber, cost-effective telecom-fiber supercontinuum source based measurement.
• Custom spectral shape (power spectral density drops exponentially towards longer wavelengths) to achieve high measurement accuracy with large measurement range.

Research outputs

Contactless temperature measurement of an in-process silicon wafer using a spectrally shaped supercontinuum source

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Filed Patent

“Method and system for temperature measurement of semiconductor wafer”. (Application No. 202541030568, filed March 2025)

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