JOURNALS

1. Goswami, Abhigyan, Swathi Padmanabhan, Sarthak Dash, Jaya Prakash, and V. R. Supradeepa. “Pulsed cascaded Raman fiber laser widely tunable in the second near-infrared and visible window for hyperspectral photoacoustic imaging.” Optics Letters 50, no. 7 (2025):  2223-2226.  https://doi.org/10.1364/OL.553618. (selected for Spotlight on Optics in Optica Publishing house).
2. Goswami, Abhigyan, Sarthak Dash, Sushobhan Avasthi, and V. R. Supradeepa. “Contactless temperature measurement of an in-process silicon wafer using a spectrally shaped supercontinuum source.” Optics Express 33, no. 9 (2025): 19677-19688. https://doi.org/10.1364/OL.553618.

PEER-REVIEWED CONFERENCE PUBLICATIONS:

1. Goswami, Abhigyan, Swathi Padmanabhan, Sarthak Dash, Jaya Prakash, and V. R. Supradeepa. “Widely tunable Raman fiber laser for hyperspectral photoacoustic imaging.” In Photons Plus Ultrasound: Imaging and Sensing 2025, vol. 13319, pp. 193-197. SPIE, 2025. https://doi.org/10.1117/12.3043020
2. Goswami, Abhigyan, et al. “Passively Q-switched Raman fiber laser source widely tunable in near infrared and visible window.” Nonlinear Frequency Generation and Conversion: Materials and Devices XXIV. Vol. 13347. SPIE, 2025.
3. Goswami, Abhigyan, et al. “Photoacoustic Spectroscopy Using a Widely Tunable Pulsed Cascaded Raman Fiber Laser”. Accepted for oral presentation in CLEO®/Europe-EQEC 2025 Conference.
4. A. Goswami, S. Dash, R. Deheri, et al., “Pulsed Cascaded Raman Fiber Laser with Wide Wavelength Tunability,” in Proceedings of the 2022 Conference on Lasers and Electro-Optics Pacific Rim (2022), Paper CTuP1D_02, (Optica Publishing Group, 2022), p. CTuP1D_02. doi: 10.1364/CLEOPR.2022.CTuP1D_02
5. A. Goswami, S. Dash, R. Deheri, and V. R. Supradeepa, “Widely tunable visible pulsed cascaded Raman fiber laser source,” in Nonlinear Frequency Generation and Conversion: Materials and Devices XXIII, SPIE, Mar. 2024, pp. 103–107. doi: 10.1117/12.3000916
6. S. Dash, A. Goswami (Equal Contribution), R. Deheri, S. Avasthi, and V. R. Supradeepa, “Multi-point thermal monitoring of silicon wafer under processing utilizing a spectrally shaped supercontinuum source,” in High-Power Laser Materials Processing: Applications, Diagnostics, and Systems XIII, SPIE, Mar. 2024, pp. 123–126. doi: 10.1117/12.3002717.